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A technical academic book titled 'Intelligente Herstellung zuverlässiger Kupfer-bondverbindungen', published by Springer Vieweg. This volume serves as a final report on the InCuB project within the 'it's OWL' technology network, focusing on the development of intelligent processes for reliable copper wire bonding in mass production. The book explores ultrasonic bonding, wear models, and self-optimizing machine concepts. Condition is Like New, showing minimal signs of handling. Perfect for engineering professionals, researchers, or students interested in mechatronics and manufacturing technology.
Intelligente Herstellung Zuverlässiger Kupfer-Bondverbindungen - Springer Vieweg
$70.00